@article{paperid:1006416, author = {Rezaee Bazzaz, Abolfazl}, title = {Impression creep behavior of lead-free Sn–5Sb solder alloy}, journal = {Materials Science and Engineering: A}, year = {2007}, month = {July}, issn = {0921-5093}, keywords = {Impression creep; Lead-free solder; Stress exponent; Activation energy}, }