@article{paperid:1037012,
author = {Joodaki, Mojtaba and G. Kompa and H. Hillmer},
title = {Thermomechanical stress analysis and measurement in quasi-monolithic integration technology (QMIT)},
journal = {IEEE Transactions on Device and Materials Reliability},
year = {2005},
volume = {5},
number = {3},
month = {September},
issn = {1530-4388},
pages = {581--594},
			numpages = {13},
keywords = {Finite-element simulation; quasi-monolithic integration technology; RF packaging; thermomechanical stress},
}