@article{paperid:1075597,
author = {Hosseinzaei, Behnam and Kiani Rashid, Ali Reza},
title = {Transient liquid phase bonding in the Cu-Sn system},
journal = {Soldering and Surface Mount Technology},
year = {2019},
volume = {31},
number = {4},
month = {September},
issn = {0954-0911},
pages = {221--226},
			numpages = {5},
keywords = {Inter-metallic compounds; Shear strength; Microhardness; Isothermal solidification; Microelectronics; Transient liquid phase},
}