@inproceedings{paperid:1082122,
author = {Shokhmkar, Reza and Abolfazli Esfahani, Javad and Amir Mirzagheytaghi},
title = {Simulation of epoxy flow in Integrated Circuit Encapsulation Process and  Optimization of Process Parameters with Taguchi method},
booktitle = {2020 Fall Conference of the Korean Society of Visualization},
year = {2020},
location = {Gwangju, south korea},
keywords = {underfilling encapsulation; injection situation; solder bump shape; air traps},
}