The 12th International Conference on Microelectronics , 2000-10-31

Title : ( Static thermal design of quasi monolithic technology (QMT) for realization of power microwave and millimeter wave circuits )

Authors: Mojtaba Joodaki ,

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Abstract

In this paper, a 2D finite element heat transfer simulation was used to optimize the quasi monolithic technology (QMT) structure and to reduce thermal resistance in power microwave and millimeter wave applications, considering limitations in the fabrication process. Effects of different factors and parameters such as epoxy thermal conductivity, distance between active device and Si substrate, front side substrate metallization and heat spreader on the back side have been described. Results show that by using a good heat spreader on the backside of the active device, total thermal resistance comparable to that in standard MMICs is possible

Keywords

Static thermal design; quasi monolithic technology (QMT)
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@inproceedings{paperid:1037023,
author = {Joodaki, Mojtaba},
title = {Static thermal design of quasi monolithic technology (QMT) for realization of power microwave and millimeter wave circuits},
booktitle = {The 12th International Conference on Microelectronics},
year = {2000},
location = {تهران, IRAN},
keywords = {Static thermal design; quasi monolithic technology (QMT)},
}

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%0 Conference Proceedings
%T Static thermal design of quasi monolithic technology (QMT) for realization of power microwave and millimeter wave circuits
%A Joodaki, Mojtaba
%J The 12th International Conference on Microelectronics
%D 2000

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