IEEE Electrical Performance of Electronic Packaging, 2006 , 2006-10-23

Title : ( Interconnects Analyses in Quasi-Monolithic Integration Technology (QMIT) )

Authors: Mojtaba Joodaki , A.G. Qimonda , A. Kricke , H. Hillmer , G. Kompa ,
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Abstract

Three dimensional (3D) full-wave electromagnetic simulations are used to investigate high frequency performance of interconnects in quasi-monolithic integration technology (QMIT). The results are calculated for different structures of QMIT, earlier concept and new concept, and compared with those of other assembly technologies such as bond wire, hybrid integration, and flip-chip. The insertion loss (magnitude of S21) of the second type of the earlier concept (EC) and the new concept (NC) of QMIT at 40 GHz are just -0.36 dB and -0.26 dB, respectively. This means that the QMIT interconnects have excellent performances up to millimetre-wave frequency ranges

Keywords

, Interconnects Analyses; Quasi, Monolithic Integration Technology (QMIT)
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@inproceedings{paperid:1037036,
author = {Joodaki, Mojtaba and A.G. Qimonda and A. Kricke and H. Hillmer and G. Kompa},
title = {Interconnects Analyses in Quasi-Monolithic Integration Technology (QMIT)},
booktitle = {IEEE Electrical Performance of Electronic Packaging, 2006},
year = {2006},
location = {Scottsdale, AZ, USA},
keywords = {Interconnects Analyses; Quasi-Monolithic Integration Technology (QMIT)},
}

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%0 Conference Proceedings
%T Interconnects Analyses in Quasi-Monolithic Integration Technology (QMIT)
%A Joodaki, Mojtaba
%A A.G. Qimonda
%A A. Kricke
%A H. Hillmer
%A G. Kompa
%J IEEE Electrical Performance of Electronic Packaging, 2006
%D 2006

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