Title : ( Thermal stress in Quasi Monolithic Integration Technology (QMIT) )
Authors: Mojtaba Joodaki , T. Senyildiz , G. Kompa , T. Leinhos , R. Kassing , H. Hilmer ,
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Abstract
In this paper thermal stress distribution in QMIT structure which results from differences in thermal expansion coefficient of materials involved, has been simulated and measured. A three dimensional finite element method and a nano meter surface profiler (DEKTAK) have been used to simulate and measure the displacement results from the created Strain after baking or the epoxy. The results are not only useful for investigation of reliability and life time of packaging but also for device modeling and characteristics which is crucial in microwave and mm-wave design.
Keywords
, Thermal stress, Quasi Monolithic Integration Technology, QMIT
@inproceedings{paperid:1038258,
author = {Joodaki, Mojtaba and T. Senyildiz and G. Kompa and T. Leinhos and R. Kassing and H. Hilmer},
title = {Thermal stress in Quasi Monolithic Integration Technology (QMIT)},
booktitle = {11th Conference on Microwaves, Radio Communication and Electromagnetic Compatibility (MIOP)},
year = {2001},
location = {Stuttgart, Germany, GERMANY},
keywords = {Thermal stress; Quasi Monolithic Integration Technology; QMIT},
}
%0 Conference Proceedings
%T Thermal stress in Quasi Monolithic Integration Technology (QMIT)
%A Joodaki, Mojtaba
%A T. Senyildiz
%A G. Kompa
%A T. Leinhos
%A R. Kassing
%A H. Hilmer
%J 11th Conference on Microwaves, Radio Communication and Electromagnetic Compatibility (MIOP)
%D 2001
