This study was aimed at evaluating the suitability of sesame paste as an ingredient in white compound chocolate using response surface methodology. A D‐optimal combined mixture‐process design with three mixture components, sesame paste (15%–30% w/w), soy flour (0%–15% w/w), and milk powder (0%–15% w/w) under variable amount of emulsifier was used to optimize textural (hardness, cohesiveness, and adhesive force) and thermal (Tonset and Tm) properties of white compound chocolate containing sesame paste. The results showed that the linear effect of all the mixture components was significant (p < .05) on the responses. Applying a desirability function method, the optimum proportion of mixture components, and emulsifier level were as follows: sesame paste 15.5% w/w, milk powder 7.5% w/w, soy four 7% w/w, and emulsifier 0% w/w, respectively. At optimum point, hardness, cohesiveness, adhesive force, Tonset, and Tm were 367.07 (N), 0.63, 8.46 (N), 28.1 (°C), and 33.7 (°C), respectively. The predicted values were confirmed through validation experiment.

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