The design and development of reliable electronic systems is a highly challenging task. In this paper we present the results of research carried out in order to improve the reliability of the printed circuit boards of a high reliability electronic consumer product manufactured locally by the application of accelerated life testing and interconnect stress testing. Reliability improvement is a major goal in many applications. It is especially vital in sensitive devices where human life is involved such as high reliability products, medical electronic systems as well as military applications. Accelerated life testing is a well known technique for reliability improvement of electronic systems. However, its application to printed circuit boards is very difficult. The various types of tests to be performed on the printed circuit board are outlined. A three stage testing procedure to be carried out after visual inspection and microscopic assisted inspection is proposed in order to improve the reliability of the printed circuit boards of the consumer product being manufactured locally. Results of actual implementation of this procedure are presented. This procedure includes microscope assisted visual inspection, interconnect stress testing before part assembly, plus accelerated life testing through thermal and vibration cycling after part assembly. These tests can be used to discover any physical weaknesses in the materials, poor workmanship or design, or the use of any weak parts. They are also used to find the lifetime of the printed circuit boards under accelerated life conditions, and their Weibull probability distribution which can be projected to real operating conditions using Arrhenius equation.

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