Title : ( Quasi-Monolithic Hybrid Technology Based on Si Micromachining and Low-Temperature Thin-Film Processing )
Authors: G. Kompa , W. Wasige , Mojtaba Joodaki ,
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Abstract
A novel planar quasi-monolithic (QM) hybrid integration technology for microwave and millimeter wave application is presented. Microwave transistor chips are embedded in micromachined openings in high-resistivity silicon (HRS) substrate material with a vertical precision of better than 2 pm and lateral tolerances less than 10 pm. Air-bridge technology and low-temperature thinfilm techniques are then used to provide the necessary inter connections. First validation of the proposed QM integration concept is demonstrated at the low-power circuit level by a HEMT oscillator with an oscillating frequency of about 11.35 GHz.
Keywords
, Quasi-Monolithic Hybrid Technology, Micromachining, Thin-Film Processing
@inproceedings{paperid:1038256,
author = {G. Kompa and W. Wasige and Joodaki, Mojtaba},
title = {Quasi-Monolithic Hybrid Technology Based on Si Micromachining and Low-Temperature Thin-Film Processing},
booktitle = {VDE world micro-technologies congress; Micro.tec 2000 applications - trends - visions},
year = {2000},
location = {Hanover, Germany, GERMANY},
keywords = {Quasi-Monolithic Hybrid Technology; Micromachining; Thin-Film Processing},
}
%0 Conference Proceedings
%T Quasi-Monolithic Hybrid Technology Based on Si Micromachining and Low-Temperature Thin-Film Processing
%A G. Kompa
%A W. Wasige
%A Joodaki, Mojtaba
%J VDE world micro-technologies congress; Micro.tec 2000 applications - trends - visions
%D 2000
