Title : ( TiAl3 Formation in the Titanium-Aluminum Diffusion Couple )
Authors: Mostafa Mirjalili , Mansour Soltanieh , Kiyotaka Matsuura , Munekazu Ohno ,Access to full-text not allowed by authors
Abstract
Pure titanium and aluminum sheets were used to prepare titanium-aluminum diffusion couples. The diffusion couples were heated to temperatures 550, 575, 600, 625, 640, 650 and 700°C. SEM observations of the titanium-aluminum interface and EPMA results revealed that a TiAl3 intermetallic layer has formed and thickened between the layers. Grain boundaries of the TiAl3 compound, which were revealed by back-scattered electron imaging, indicated a size distribution across the layer. Finer grains which were located close to the titanium showed that TiAl3 has nucleated at the Ti-TiAl3 interface. Thus, the former grains which had formed close to the aluminum-rich side have grown and coarsened during annealing at high temperatures. Grain coarsening of TiAl3 decreased the kinetics of the layer thickening.
Keywords
Intermetallic compound; Titanium aluminide; TiAl3; Diffusion couple; Grain growth@article{paperid:1039215,
author = {Mirjalili, Mostafa and Mansour Soltanieh and Kiyotaka Matsuura and Munekazu Ohno},
title = {TiAl3 Formation in the Titanium-Aluminum Diffusion Couple},
journal = {Defect and Diffusion Forum},
year = {2012},
volume = {322},
number = {1},
month = {March},
issn = {1012-0386},
pages = {185--194},
numpages = {9},
keywords = {Intermetallic compound; Titanium aluminide; TiAl3; Diffusion couple; Grain growth},
}
%0 Journal Article
%T TiAl3 Formation in the Titanium-Aluminum Diffusion Couple
%A Mirjalili, Mostafa
%A Mansour Soltanieh
%A Kiyotaka Matsuura
%A Munekazu Ohno
%J Defect and Diffusion Forum
%@ 1012-0386
%D 2012