Piezoelectric patches are often bonded to composite substrates using adhesives. Performance of an adhesive bonding is highly related to the degree of integration between the bonded materials. Therefore, appropriate pre-bonding operations like cleaning the joining surfaces, controlling the temperature and humidity, etc. are so important. During joining by adhesive, also, care should be taken to prevent entering extra particles within the adhesive layer as well as formation of interfacial voids which may cause premature failure. Detachment of adhesive bonding due to high interfacial stress concentrations around a void is a major challenge, and therefore, it is important to accurately determine peak stress values for further failure analyses. As a previously approved analytical framework, the full layerwise theory is used in this study to determine the accurate distributions of interfacial stresses at mid-surface of the adhesive layer containing a void in a composite joint integrated with a piezoelectric actuator. The present method is shown to be fast convergent as well.

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