Title : ( Two-step heating transient liquid phase bonding of Inconel 738LC )
Authors: A.Amirkhani , Behrooz Beidokhti , K.Shirvani , .R.Rahimipour ,
Full TextAbstract
The high-temperature short-time heating step was followed by the low-temperature isothermal solidification step to join IN-738LC superalloy. The shorter bonding time can be applied in comparison to the conventional transient liquid phase process. A dendritic-cell like initial interface was observed which is different from a planar interface of conventional TLP bonds. This led to non-uniform distribution of voids along the joint. By completion of the isothermal solidification, quantity and size of the voids were decreased. A homogenization heat treatment produced the microstructure similar to that of the base metal.
Keywords
, Two, step heating TLP; Bonding; Superalloy; Microstructure
@article{paperid:1073898,
author = {A.Amirkhani and Beidokhti, Behrooz and K.Shirvani and .R.Rahimipour},
title = {Two-step heating transient liquid phase bonding of Inconel 738LC},
journal = {Journal of Materials Processing Technology},
year = {2019},
volume = {266},
number = {4},
month = {April},
issn = {0924-0136},
pages = {1--9},
numpages = {8},
keywords = {Two-step heating TLP; Bonding; Superalloy; Microstructure},
}
%0 Journal Article
%T Two-step heating transient liquid phase bonding of Inconel 738LC
%A A.Amirkhani
%A Beidokhti, Behrooz
%A K.Shirvani
%A .R.Rahimipour
%J Journal of Materials Processing Technology
%@ 0924-0136
%D 2019
