2020 Fall Conference of the Korean Society of Visualization , 2020-11-05

Title : ( Simulation of epoxy flow in Integrated Circuit Encapsulation Process and Optimization of Process Parameters with Taguchi method )

Authors: reza shokhmkar , Javad Abolfazli Esfahani , Amir Mirzagheytaghi ,

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Abstract

In integrated circuit(IC)packages, flip chips are sometimes used for high-density electronic packaging. A weakness in the flip chip process is the solders that typically connect the flip chip to the board. During service, the solder can be damaged, mainly from the stresses associated with the temperature changes of the package. Underfilling encapsulation is the process of filling the cavity between the chip and the substrate with a thermoset epoxy. This process helps to protect the solder bumps during service. Shen et al. [1] used the finite element simulation in a three-dimensional chip. Also, important processing parameters such as injection temperature, mold temperature, injection pressure, and injection situation were analyzed. Khor et al. [2] presented a three dimensional simulation of pressurized underfilling of flip chip package. They focused on the effects of pressure distribution within the flip chip for types of injection situations. In the present study, the goal is to simulate the polymer fluid front for different injection situations. In addition to the influence of the injection situation, the effect of solder bump shapes is also investigated at different inlet boundary conditions. The melt front profiles for all injection types are presented. The influence of these parameters on air traps, weld lines, warpage, and deformation in IC packages are discussed.

Keywords

underfilling encapsulation; injection situation; solder bump shape; air traps
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@inproceedings{paperid:1082122,
author = {Shokhmkar, Reza and Abolfazli Esfahani, Javad and Amir Mirzagheytaghi},
title = {Simulation of epoxy flow in Integrated Circuit Encapsulation Process and Optimization of Process Parameters with Taguchi method},
booktitle = {2020 Fall Conference of the Korean Society of Visualization},
year = {2020},
location = {Gwangju, south korea},
keywords = {underfilling encapsulation; injection situation; solder bump shape; air traps},
}

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%0 Conference Proceedings
%T Simulation of epoxy flow in Integrated Circuit Encapsulation Process and Optimization of Process Parameters with Taguchi method
%A Shokhmkar, Reza
%A Abolfazli Esfahani, Javad
%A Amir Mirzagheytaghi
%J 2020 Fall Conference of the Korean Society of Visualization
%D 2020

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